Intel, TSMC Reach Agreement to Collaborate

Intel, TSMC Reach Agreement to Collaborate on Technology Platform, IP Infrastructure, SoC SolutionsIntel to port Atom CPU cores to TSMC’s technology platform to expand market for Atom Processors SoC Customers Santa Clara, CA & Hsin-chu, Taiwan, March 2, 2009 – Intel Corporation and TSMC today announced a memorandum of understanding (MOU) to collaborate on addressing technology platform, intellectual property (IP) infrastructure, and System-on-Chip (SoC) solutions. Under the MOU, Intel would port its Atom

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