VIA Moves into COM Express Embedded Module MarketVIA to introduce first COM Express modules with VIA processor platform, enabling cost effective, flexible customization and faster time to market Taipei, Taiwan, April 14th 2008 – VIA Technologies, Inc, a leading innovator and developer of embedded silicon and platform technologies, today announced the extension of embedded board portfolio to include COM Express modules that will be the first to harness the power and thermal advantages of VIA’s processor platforms.